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17th May 2018, Moscow

New composite to prevent gadgets overheating

Scientists at the Russian National University of Science and Technology (MISiS), the country’s primary technological university in the fields of steelmaking and metallurgy, have designed a new composite material with the ability to improve the cooling efficiency of various electronic devices, reports Eugene Gerden.

The overheating of gadgets is a serious problem leading to the degradation of electronic components and unstable operation or even failure. In the case of computers and smartphones, their processors and video cards are the most sensitive to temperature increases.

Russia's MISiS, one of the scientific clusters for design and production of composites. © Eugene Gerden

The new lightweight composite materials with high thermal conductivity and good mechanical properties have been designed at MISiS to prevent this.

“Our goal was to develop a material that conducts heat and does not conduct an electric current,” said a MISiS spokesman. “Its composite base potentially costs less than the current reinforced laminates in printed circuit boards or small-sized electronics housings, where noticeable heat release is observed.

The new technology is said to be based on a combination of high-density polyethylene and boron nitride as a filler material.

Series production of the new material is being planned by a number of leading Russian composite producers in the coming months, with costs saving of between 7-12% anticipated.

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